Principal Engineer, Process Engineering
The candidate will be responsible for Wet Process Engineering in a wafer fabrication environment. In this capacity, will support manufacturing engineering activities including process control, process and tool troubleshooting, and wafer disposition. Furthermore, will assume a key leading role driving existing process optimization, continuous yield improvement, cycle time/cost reduction, failure analysis, and new processes qualification and ramping up into manufacturing.
Responsibilities:
Responsible for Electroplating, Wet Chemical Etch, Resist Strip, and Liftoff processes in a 24x7 wafer fab.
Responsible for implementing, maintaining, and optimizing SPC/APC process control schemes.
Disposition wafers on hold following specifications and establish out-of-control action plans.
Perform Failure Analysis on defective wafers and implement corrective and preventive actions.
Be focal point for continuous process improvement working with various teams: Manufacturing, Equipment Engineering, Process engineering, Vendors, Development, etc.
Responsible for achieving yield, cost, and cycle time goals.
Support new technology / design development, introduction, and production ramp up.
Evaluate / qualify new equipment, materials, and processes.
Document and provide training to manufacturing team.
BS degree in Chemical Engineering, Chemistry, Material Science or related fields. MS or PhD preferred.
Minimum of 5 years hands-on experience in most of the following areas: Electroplating of ferromagnetic alloys and pure metals, wet chemical etch of metal alloys and dielectric materials, photoresist strip, liftoff patterning, and wet cleaning processes.
Strong background and experience in statistical data analysis is required.
Experience in wafer-level magnetic recording head fabrication is desirable.
Self-starter with strong initiative & detail-oriented approach.
Excellent communication skills with ability to work in cross-functional team setting.
Must possess manufacturing process engineer mindset, ability to work in high-pace dynamic environment, and ability to multi-task.
. Apply now!Estimated Salary: $20 to $28 per hour based on qualifications.
Responsibilities:
Responsible for Electroplating, Wet Chemical Etch, Resist Strip, and Liftoff processes in a 24x7 wafer fab.
Responsible for implementing, maintaining, and optimizing SPC/APC process control schemes.
Disposition wafers on hold following specifications and establish out-of-control action plans.
Perform Failure Analysis on defective wafers and implement corrective and preventive actions.
Be focal point for continuous process improvement working with various teams: Manufacturing, Equipment Engineering, Process engineering, Vendors, Development, etc.
Responsible for achieving yield, cost, and cycle time goals.
Support new technology / design development, introduction, and production ramp up.
Evaluate / qualify new equipment, materials, and processes.
Document and provide training to manufacturing team.
BS degree in Chemical Engineering, Chemistry, Material Science or related fields. MS or PhD preferred.
Minimum of 5 years hands-on experience in most of the following areas: Electroplating of ferromagnetic alloys and pure metals, wet chemical etch of metal alloys and dielectric materials, photoresist strip, liftoff patterning, and wet cleaning processes.
Strong background and experience in statistical data analysis is required.
Experience in wafer-level magnetic recording head fabrication is desirable.
Self-starter with strong initiative & detail-oriented approach.
Excellent communication skills with ability to work in cross-functional team setting.
Must possess manufacturing process engineer mindset, ability to work in high-pace dynamic environment, and ability to multi-task.
. Apply now!Estimated Salary: $20 to $28 per hour based on qualifications.
|
|
 | |
